US 12,250,790 B2
Liquid cooling device
Jiang-Jun Wu, Shanghai (CN); Yi-Dong Ji, Shanghai (CN); Shu-Kang Han, Shanghai (CN); and Ke Sun, Shanghai (CN)
Assigned to INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai (CN); and INVENTEC CORPORATION, Taipei (TW)
Filed by INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai (CN); and INVENTEC CORPORATION, Taipei (TW)
Filed on Mar. 20, 2023, as Appl. No. 18/123,452.
Claims priority of application No. 202211104761.2 (CN), filed on Sep. 9, 2022.
Prior Publication US 2024/0090168 A1, Mar. 14, 2024
Int. Cl. F28F 7/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 7/20254 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A liquid cooling device, comprising:
a base plate configured to be provided on a heat source;
a cooling body provided on a side of the base plate away from the heat source, the cooling body comprising a frame, a cooling layer provided in the frame, and a reflux layer provided above the cooling layer, the cooling layer being provided with a plurality of cooling channels extending from a center portion of the cooling body to the frame, the reflux layer being provided with a plurality of reflux channels in communication with the plurality of cooling channels, a periphery of the reflux layer being provided with a drainage flow channel in communication with the plurality of the reflux channels; and
a cover plate provided on a side of the cooling body away from the base plate, a center portion of the cover plate being provided with a liquid inlet in communication with the plurality of cooling channels, and the cover plate being further provided with a liquid outlet in communication with the drainage flow channel.