US 12,250,788 B2
Enhanced thermal management in electrical boxes using passive cooling
Albert Pedoeem, West Orange, NJ (US); Kriss Replogle, Morristown, NJ (US); and Charles Magrino, Cresskill, NJ (US)
Assigned to Crestron Electronics, Inc., Rockleigh, NJ (US)
Filed by Crestron Electronics, Inc., Rockleigh, NJ (US)
Filed on Mar. 22, 2023, as Appl. No. 18/124,810.
Application 18/124,810 is a continuation in part of application No. 17/868,941, filed on Jul. 20, 2022, granted, now 12,016,153.
Prior Publication US 2024/0032237 A1, Jan. 25, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20172 (2013.01) [H05K 7/20409 (2013.01); H05K 7/20436 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for cooling electronic circuitry, the apparatus comprising:
(a) a housing configured to enclose the electronic circuitry and being mountable inside a back box, the housing including
(1) a plurality of surfaces, each one of the plurality of surfaces being configured to face an adjacent one of a plurality of inner walls of the back box upon the housing being mounted inside the back box, the plurality of surfaces including
(A) a rear surface configured to face a rear wall of the plurality of inner walls of the back box upon the housing being mounted inside the back box;
(b) a mounting plate disposed opposite to the rear surface, the mounting plate being in thermal contact with the housing and being configured to face away from the back box upon the housing being mounted inside the back box; and
(c) a touch plate disposed atop of, and in thermal contact with, the mounting plate, wherein
(1) the mounting plate and the touch plate combine to provide a path for conducting heat generated by the electronic circuitry away from the housing and for radiating the heat to ambient air, and
(2) one of the mounting plate or the touch plate is made of a material that has a higher thermal conductivity than another of the mounting plate or the touch plate to facilitate the conduction of the heat away from the housing.