US 12,250,783 B2
Connector module and substrate structure
Ryoma Hamada, Yokkaichi (JP); Akihiro Oda, Yokkaichi (JP); Yuya Matsuo, Yokkaichi (JP); Noriko Okamoto, Yokkaichi (JP); and Tatsuya Daidoji, Yokkaichi (JP)
Assigned to Sumitomo Wiring Systems, Ltd., Yokkaichi (JP)
Appl. No. 17/759,637
Filed by Sumitomo Wiring Systems, Ltd., Yokkaichi (JP)
PCT Filed Jan. 19, 2021, PCT No. PCT/JP2021/001598
§ 371(c)(1), (2) Date Jul. 28, 2022,
PCT Pub. No. WO2021/153324, PCT Pub. Date Aug. 5, 2021.
Claims priority of application No. 2020-014062 (JP), filed on Jan. 30, 2020.
Prior Publication US 2023/0069880 A1, Mar. 9, 2023
Int. Cl. H05K 7/06 (2006.01); H01R 13/502 (2006.01); H02G 3/16 (2006.01); H05K 1/18 (2006.01); H05K 7/02 (2006.01)
CPC H05K 7/06 (2013.01) [H01R 13/502 (2013.01); H02G 3/16 (2013.01); H05K 1/181 (2013.01); H05K 7/026 (2013.01); H05K 1/182 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A connector module that is provided with an input port and an output port that are configured to be connected to an external member, and is to be mounted on a substrate, the connector module comprising:
a bus bar that is separated from the substrate and connects a terminal of the input port and a terminal of the output port to each other; and
an insulating member that is interposed between the bus bar and the substrate.