US 12,250,773 B2
Wiring board and wiring board manufacturing method
Toshiaki Aoki, Nagano (JP); and Toyoaki Sakai, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Jul. 6, 2022, as Appl. No. 17/858,163.
Claims priority of application No. 2021-112310 (JP), filed on Jul. 6, 2021; and application No. 2022-017380 (JP), filed on Feb. 7, 2022.
Prior Publication US 2023/0009751 A1, Jan. 12, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/186 (2013.01) [H05K 1/115 (2013.01); H05K 3/0094 (2013.01); H05K 3/422 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/086 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/1003 (2013.01); H05K 2203/072 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A wiring board comprising:
a base material that has metallic foils formed on opposite surfaces thereof;
a through hole that is formed in the base material between the opposite surfaces of the base material;
a magnetic member that is embedded in the through hole; and
a plating film that covers end faces of the magnetic member, the end faces being exposed from the through hole, wherein
the magnetic member includes a conductor wire that is covered by a magnetic body,
the end faces of the magnetic member are polished surfaces that are flush with surfaces of the metallic foils, and
both ends of the magnetic member respectively protrude from the opposite surfaces of the base material with the magnetic member embedded in the through hole, the ends of the magnetic member respectively including the end faces of the magnetic member.