US 12,250,769 B2
Circuit board and manufacturing method thereof
Kuan-Yu Chen, Taoyuan (TW); and Hsiao-Lung Lin, New Taipei (TW)
Filed by Kuan-Yu Chen, Taoyuan (TW); and Hsiao-Lung Lin, New Taipei (TW)
Filed on Jun. 17, 2022, as Appl. No. 17/842,796.
Claims priority of application No. 110122308 (TW), filed on Jun. 18, 2021.
Prior Publication US 2022/0408563 A1, Dec. 22, 2022
Int. Cl. H05K 1/11 (2006.01); H05K 1/05 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/44 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 1/05 (2013.01); H05K 3/4038 (2013.01); H05K 3/445 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A circuit board, comprising:
a metal substrate, having a first through hole, and the first through hole having a first width;
a resin layer, and a portion of the resin layer disposed in the first through hole, wherein the resin layer has a second through hole, and the second through hole has a second width;
an insulating layer, disposed on at least one surface of the metal substrate, and a portion of the insulating layer contacting the resin layer;
a first conductive structure, disposed in the second through hole, and the first conductive structure penetrating through the metal substrate, wherein the first width is greater than the second width; and
a conductive layer, disposed on the insulating layer, wherein the first conductive structure is disposed on the conductive layer, and the conductive layer is located between the insulating layer and the first conductive structure.