US 12,250,768 B2
Sensor interposer employing castellated through-vias
Sean Frick, San Francisco, CA (US); Louis Jung, Foster City, CA (US); and David Lari, San Francisco, CA (US)
Assigned to DexCom, Inc., San Diego, CA (US)
Filed by DexCom, Inc., San Diego, CA (US)
Filed on Oct. 17, 2023, as Appl. No. 18/381,074.
Application 18/381,074 is a continuation of application No. 17/542,977, filed on Dec. 6, 2021, granted, now 11,950,363.
Application 17/542,977 is a continuation of application No. 16/850,986, filed on Apr. 16, 2020, granted, now 11,224,125, issued on Jan. 11, 2022.
Application 16/850,986 is a continuation of application No. 16/282,587, filed on Feb. 22, 2019, granted, now 10,660,201, issued on May 19, 2020.
Claims priority of provisional application 62/634,085, filed on Feb. 22, 2018.
Prior Publication US 2024/0049388 A1, Feb. 8, 2024
Int. Cl. H05K 1/02 (2006.01); A61B 5/00 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H03B 5/32 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); A61B 5/145 (2006.01); A61B 5/1468 (2006.01); G01N 27/327 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/112 (2013.01) [A61B 5/6802 (2013.01); H01L 21/768 (2013.01); H01L 23/481 (2013.01); H05K 1/0262 (2013.01); H05K 3/403 (2013.01); A61B 5/14532 (2013.01); A61B 5/14546 (2013.01); A61B 5/1468 (2013.01); A61B 5/6848 (2013.01); G01N 27/327 (2013.01); H05K 1/0219 (2013.01); H05K 1/141 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/049 (2013.01); H05K 2201/0792 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10378 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method of forming a sensor interposer comprising:
provide a planar substrate;
forming a plurality of through-vias in the planar substrate;
cutting a portion of the planar substrate to create an interposer substrate, the cutting comprising cutting through at least four of the through-vias to create at least four castellated through-vias;
forming a first electrical contact on the interposer substrate and electrically coupling the first electrical contact to a first castellated through-via;
forming a second electrical contact on the interposer substrate and electrically coupling the second electrical contact to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and
forming a guard trace on the interposer substrate, the guard trace electrically coupled between a third and a fourth through-via formed on the planar substrate, the guard trace isolating the first and second electrical contacts.