US 12,250,767 B2
Dielectric substrate and method of forming the same
Jennifer Adamchuk, Marlborough, MA (US); Gerard T. Buss, Bedford, NH (US); and Theresa M. Besozzi, Milford, MA (US)
Assigned to VERSIV COMPOSITES LIMITED, Kilrush (IE)
Filed by VERSIV COMPOSITES LIMITED, Kilrush (IE)
Filed on Sep. 21, 2023, as Appl. No. 18/471,816.
Application 18/471,816 is a continuation of application No. 18/157,918, filed on Jan. 23, 2023, granted, now 11,805,600.
Application 18/157,918 is a continuation of application No. 17/443,390, filed on Jul. 26, 2021, granted, now 11,596,064, issued on Feb. 28, 2023.
Claims priority of provisional application 63/057,670, filed on Jul. 28, 2020.
Prior Publication US 2024/0023242 A1, Jan. 18, 2024
Int. Cl. H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01)
CPC H05K 1/0373 (2013.01) [H05K 1/05 (2013.01); H05K 1/09 (2013.01); H05K 2201/0358 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A dielectric substrate comprising:
a polyimide layer and
a first filled polymer layer overlying the polyimide layer, wherein the first filled polymer layer comprises a first resin matrix component; and
a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material, wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns, and
wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g.