US 12,250,766 B2
Antenna module
Jae Woong Choi, Suwon-si (KR); and Jin Won Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jul. 27, 2023, as Appl. No. 18/227,108.
Application 18/227,108 is a division of application No. 17/198,643, filed on Mar. 11, 2021, granted, now 11,758,646.
Claims priority of application No. 10-2020-0084613 (KR), filed on Jul. 9, 2020.
Prior Publication US 2023/0371173 A1, Nov. 16, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/02 (2006.01); H01Q 9/04 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0243 (2013.01) [H01Q 1/02 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0414 (2013.01); H05K 1/0203 (2013.01); H05K 1/115 (2013.01); H05K 2201/10098 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An antenna module, comprising:
a wiring structure;
an antenna disposed on an upper surface of the wiring structure in a stacking direction and including a dielectric layer and an antenna pattern disposed on the dielectric layer, the dielectric layer having a first side surface and a second side surface opposing each other in a direction perpendicular to the stacking direction;
a plurality of conductor lumps disposed on the upper surface of the wiring structure and spaced apart from the antenna; and
an encapsulant disposed on the upper surface of the wiring structure and covering the antenna and at least a portion of each of the plurality of conductor lumps,
wherein a portion of the encapsulant comprising an insulating material is arranged between a first conductor lump of the plurality of conductor lumps and the first side surface of the dielectric layer in the direction perpendicular to the stacking direction, such that the first conductor lump of the plurality of conductor lumps overlaps the first side surface of the dielectric layer in the direction perpendicular to the stacking direction, and
wherein another portion of the encapsulant comprising an insulating material is arranged between a second conductor lump of the plurality of conductor lumps and the second side surface of the dielectric layer in the direction perpendicular to the stacking direction, such that the second conductor lump of the plurality of conductor lumps overlaps the second side surface of the dielectric layer in the direction perpendicular to the stacking direction.