| CPC H05B 3/141 (2013.01) [C23C 24/04 (2013.01); H05B 2203/013 (2013.01); H05B 2203/032 (2013.01)] | 36 Claims |

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1. A heating device, comprising:
a substrate with a surface; and
a heating element disposed on the surface, the heating element including an ohmically resistive coating deposited on the surface of the substrate via at least one of a cold spray and a solid state deposition, the ohmically resistive coating having a layer thickness of 2 to 300 microns and including:
at least 30% by weight of at least one ductile or malleable metal selected from a group including: copper, aluminium, zinc, and manganese; and
a plurality of electrically resistive particles that include at least one of compounds and salts of at least one of a metal and a metalloid;
wherein the at least one ductile or malleable metal bonds the plurality of electrically resistive particles to the surface of the substrate to form the ohmically resistive coating;
wherein the ohmically resistive coating is formed via the at least one of the cold spray and the solid state deposition performed at a temperature below at least one of a melting temperature and a partially softening temperature of the at least one ductile or malleable metal;
wherein the ohmically resistive coating exhibits less heterogeneity and porosity than a thermally sprayed coating, has a density of 90% or greater, and has a porosity of 10% or less;
wherein the plurality of electrically resistive particles are disposed in the at least one ductile or malleable metal;
wherein at least a pair of electrical contacts are structured and arranged to connect to a power supply; and
wherein the power supply includes at least one of an AC power supply and a DC power supply.
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