US 12,250,334 B2
Electronic device with waterproof structure
Kiyoung Jung, Suwon-si (KR); Woosung Chun, Suwon-si (KR); Jungchul An, Suwon-si (KR); Seungki Choi, Suwon-si (KR); and Hyunju Hong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 10, 2022, as Appl. No. 17/885,286.
Application 17/885,286 is a continuation of application No. PCT/KR2022/011560, filed on Aug. 4, 2022.
Claims priority of application No. 10-2021-0105368 (KR), filed on Aug. 10, 2021; and application No. 10-2021-0106361 (KR), filed on Aug. 11, 2021.
Prior Publication US 2023/0046954 A1, Feb. 16, 2023
Int. Cl. H04M 1/05 (2006.01); G06F 1/16 (2006.01); H04M 1/02 (2006.01); H04M 1/18 (2006.01)
CPC H04M 1/18 (2013.01) [G06F 1/1652 (2013.01); G06F 1/1656 (2013.01); G06F 1/1681 (2013.01); H04M 1/0216 (2013.01); H04M 1/0268 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first housing;
a second housing;
a hinge assembly comprising a hinge disposed between the first housing and the second housing, and including a hinge plate and a hinge module disposed at both ends of the hinge plate in a longitudinal direction of the hinge plate;
a first circuit board disposed in the first housing;
a second circuit board disposed in the second housing;
a flexible display disposed on the first housing, the second housing, and the hinge assembly;
a first waterproof member comprising a waterproof material disposed between the first housing and the flexible display;
a first adhesive member comprising an adhesive disposed between the hinge module and the flexible display;
an electrical component disposed between the first waterproof member and the first adhesive member;
an electrical component waterproof member comprising a waterproof material disposed between the electrical component and the flexible display; and
a first support disposed between the electrical component waterproof member and the flexible display,
wherein an electrical component groove is formed in the first housing,
wherein the electrical component is disposed in an area of the first circuit board corresponding to the electrical component groove, and covered by the electrical component waterproof member, and
wherein a first electrical component hole coupled to the electrical component groove is formed in a part of the first housing.