US 12,250,024 B2
Data processing systems including optical communication modules
Peter Johannes Winzer, Aberdeen, NJ (US); Brett Michael Dunn Sawyer, Pasadena, CA (US); Ron Zhang, Sunnyvale, CA (US); Peter James Pupalaikis, Ramsey, NJ (US); Clinton Randy Giles, Watchung, NJ (US); Guilhem de Valicourt, Jersey City, NJ (US); and Jonathan Proesel, Mount Vernon, NY (US)
Assigned to Nubis Communications, Inc., New Providence, NJ (US)
Filed by Nubis Communications, Inc., Aberdeen, NJ (US)
Filed on Sep. 16, 2022, as Appl. No. 17/947,045.
Claims priority of provisional application 63/245,559, filed on Sep. 17, 2021.
Claims priority of provisional application 63/245,011, filed on Sep. 16, 2021.
Claims priority of provisional application 63/245,005, filed on Sep. 16, 2021.
Prior Publication US 2023/0077979 A1, Mar. 16, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 10/25 (2013.01)
CPC H04B 10/25 (2013.01) 52 Claims
OG exemplary drawing
 
1. A system comprising:
a housing comprising a bottom panel and a front panel, wherein the front panel is at an angle relative to the bottom panel in which the angle is in a range from 30° to 150°;
a first circuit board positioned inside the housing, in which the first circuit board has a length, a width, and a thickness, wherein the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width,
wherein the first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30° to 150°,
wherein the first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel when the front panel is closed in which the second angle is less than 60°;
a first data processing module electrically coupled to the first circuit board; and
a first optical interconnect module electrically coupled to the first circuit board, in which the optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.
 
31. A system comprising:
a housing comprising a bottom panel and a front panel, the front panel comprising a plurality of optical connector parts, each optical connector part is configured to be optically coupled to an external optical fiber cable and an internal optical fiber cable;
a first circuit board or a first substrate positioned in the housing, in which the first circuit board or the first substrate is oriented at an angle relative to the bottom panel in which the angle is in a range from 30° to 150°;
wherein the first circuit board or the first substrate is substantially parallel to the front panel or at an angle relative to the front panel in which the angle is less than 60°;
a plurality of optical interconnect modules electrically coupled to the first circuit board; and
a plurality of internal optical fiber cables, in which each internal optical fiber cable is optically coupled to one of the optical interconnect modules and a corresponding optical connector part on the front panel.
 
34. An apparatus comprising:
a co-packaged optical module comprising:
a photonic integrated circuit;
an optical connector coupled to a first surface of the photonic integrated circuit; and
a first set of at least two electrical integrated circuits that are coupled to the first surface of the photonic integrated circuit;
wherein the first set of at least two electrical integrated circuit comprises three electrical integrated circuits that surround three sides of the optical connector along a plane parallel to the first surface of the photonic integrated circuit.
 
40. An apparatus comprising:
a co-packaged optical module comprising:
a photonic integrated circuit;
an optical connector coupled to a first surface of the photonic integrated circuit;
a first set of at least one electrical integrated circuit that is coupled to a second surface of the photonic integrated circuit, in which the second surface is opposite to the first surface relative to the photonic integrated circuit;
wherein the photonic integrated circuit comprises an active layer at the first surface, the active layer comprises grating couplers, and at least one of photodetectors or optical modulators;
wherein the optical connector has a footprint that overlaps a footprint of the grating couplers;
wherein the at least one of photodetectors or optical modulators are spaced apart from the grating couplers; and
wherein the first set of at least one electrical integrated circuits is coupled to the at least one of photodetectors or optical modulators using through silicon vias.
 
51. An apparatus comprising:
a co-packaged optical module comprising:
a photonic integrated circuit;
an optical connector coupled to a first surface of the photonic integrated circuit;
a first set of at least one electrical integrated circuit that is coupled to a second surface of the photonic integrated circuit, wherein the second surface is opposite to the first surface relative to the photonic integrated circuit;
wherein the photonic integrated circuit comprises a silicon substrate and an active layer at the second surface;
wherein the active layer comprises grating couplers, and at least one of photodetectors or optical modulators;
wherein the optical connector is optically coupled to the grating couplers using backside illumination; and
wherein the at least one of photodetectors or optical modulators are spaced apart from the grating couplers, and the first set of at least one electrical integrated circuits is electrically coupled to the at least one of photodetectors or optical modulators.