US 12,250,017 B2
Radio frequency module and communication device
Dai Nakagawa, Kyoto (JP); Takanori Uejima, Kyoto (JP); Yuji Takematsu, Kyoto (JP); Naoya Matsumoto, Kyoto (JP); Ryohei Okabe, Kyoto (JP); and Hiromichi Kitajima, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Sep. 9, 2022, as Appl. No. 17/930,834.
Application 17/930,834 is a continuation of application No. PCT/JP2021/006888, filed on Feb. 24, 2021.
Claims priority of application No. 2020-077821 (JP), filed on Apr. 24, 2020.
Prior Publication US 2023/0006708 A1, Jan. 5, 2023
Int. Cl. H04B 1/40 (2015.01)
CPC H04B 1/40 (2013.01) 20 Claims
OG exemplary drawing
 
1. A radio frequency module comprising:
a mounting substrate having a first main surface and a second main surface, the first main surface and the second main surface of the mounting substrate being opposed to each other;
a first electronic component and a second electronic component disposed over the first main surface of the mounting substrate;
a resin layer disposed on the first main surface of the mounting substrate and covering an outer peripheral surface of the first electronic component and an outer peripheral surface of the second electronic component; and
a shield layer covering the resin layer, and the first electronic component and the second electronic component,
wherein the first electronic component includes
a first substrate having a first main surface and a second main surface, the first main surface and the second main surface of the first substrate being opposed to each other, and
a first circuit section provided on the first main surface side of the first substrate,
the second electronic component includes
a second substrate having a first main surface and a second main surface, the first main surface and the second main surface of the second substrate being opposed to each other, and
a second circuit section provided on the first main surface side of the second substrate,
a material of the first substrate and a material of the second substrate are the same, and
the shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate.