| CPC H03B 5/04 (2013.01) [H03B 5/32 (2013.01)] | 11 Claims |

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1. An oven-controlled crystal oscillator comprising: a core section; and a heat insulation package in which the core section is hermetically encapsulated, wherein
the core section includes at least: an oscillation IC; a piezoelectric resonator; a heater IC; and a core substrate provided on a rear surface of the core section,
the core substrate is mechanically connected to the package by a bonding material, and
each of the oscillation IC, the piezoelectric resonator and the heater IC of the core section is not electrically connected to the core substrate, and
at least one of the oscillation IC, the piezoelectric resonator and the heater IC of the core section and the package are electrically connected to each other by wire bonding.
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