US 12,249,922 B2
Power conversion device
Hiroki Katsube, Tokyo (JP); Shota Yamabe, Tokyo (JP); and Masakazu Tani, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Aug. 30, 2022, as Appl. No. 17/898,611.
Claims priority of application No. 2022-036934 (JP), filed on Mar. 10, 2022.
Prior Publication US 2023/0291322 A1, Sep. 14, 2023
Int. Cl. H05K 7/20 (2006.01); H02H 7/00 (2006.01); H02M 7/00 (2006.01); H05K 5/02 (2006.01)
CPC H02M 7/003 (2013.01) [H05K 5/0217 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A power conversion device comprising:
a power module including a module body portion storing a semiconductor element, and a power terminal protruding from the module body portion;
a capacitor module including a capacitor body portion storing a capacitor element, and a capacitor busbar protruding from the capacitor body portion and connected to the power terminal; and
a housing storing the power module and the capacitor module, wherein
the housing has a first surface to which the power module is thermally connected, and a second surface to which the capacitor module is thermally connected,
a coolant path transporting a fluid for cooling the first surface is provided on a back side of the first surface, the back side facing away from at least part of the capacitor busbar, and
the capacitor busbar is protruded from the capacitor module and, at a location outside of the capacitor module, thermally connected to the first surface by a layer of a heat transfer member at the location outside of the capacitor module and directly between and contacting both of the capacitor busbar and the first surface.