US 12,249,902 B2
Power semiconductor module, power electronic assembly including one or more power semiconductor modules, and power conversion control circuit for a power semiconductor module
Jens Barrenscheen, Munich (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Nov. 16, 2021, as Appl. No. 17/527,584.
Prior Publication US 2023/0155479 A1, May 18, 2023
Int. Cl. H02M 1/08 (2006.01); H02J 50/00 (2016.01); H02J 50/10 (2016.01); H02J 50/80 (2016.01); H02M 1/00 (2006.01)
CPC H02M 1/08 (2013.01) [H02J 50/005 (2020.01); H02J 50/10 (2016.02); H02J 50/80 (2016.02); H02M 1/0003 (2021.05)] 23 Claims
OG exemplary drawing
 
1. A module, comprising:
an electrically insulative housing;
a driver circuit enclosed in the housing and configured to drive a control terminal of a power switch;
a wireless communication circuit enclosed in the housing and configured to receive, through the housing, wireless control information transmitted to the module; and
a wireless energy receiver enclosed in the housing and configured to receive, through the housing, energy wirelessly transmitted to the module, and to supply power to the driver circuit,
wherein the driver circuit is configured to drive the control terminal of the power switch based on the wireless control information received by the wireless communication circuit.