US 12,249,793 B2
M2 connector with increased ampacity
Richard Perry, Portland, OR (US); Robert Schum, Roseburg, OR (US); and Mythili Hegde, Bangalore (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 22, 2021, as Appl. No. 17/559,688.
Claims priority of provisional application 63/177,282, filed on Apr. 20, 2021.
Prior Publication US 2022/0166166 A1, May 26, 2022
Int. Cl. H01R 13/64 (2006.01); H01R 12/72 (2011.01); H01R 12/73 (2011.01); H01R 13/03 (2006.01); H01R 13/04 (2006.01); H01R 13/10 (2006.01)
CPC H01R 13/64 (2013.01) [H01R 12/727 (2013.01); H01R 13/03 (2013.01); H01R 13/04 (2013.01); H01R 13/10 (2013.01); H01R 12/732 (2013.01); H01R 2201/04 (2013.01); H01R 2201/06 (2013.01); H01R 2201/24 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A socket, comprising:
an opening configured to accept a first card,
wherein the first card conforms with the M.2 standard, the opening defined by first and second sides, and
wherein a first land is formed in the first side and a second land is formed in the second side; and
a plurality of connector pins within the opening,
wherein at least a subset of the plurality of connector pins are adapted to individually carry at least one amp of current, and
wherein the socket is keyed to accept and connect with the first card, and is keyed to accept and connect with a second card requiring at least one amp of current to be carried on a plurality of pins, the second card having a first recess and a second recess formed on the sides of an edge connector, and the first and second recesses being 2.5 mm or less in depth and corresponding to the first and second lands.