US 12,249,750 B2
Communication device with heat dissipation base
Chien Lee, Hsinchu (TW); Hsiang-Chao Liu, Hsinchu (TW); and Man-Ning Lu, Hsinchu (TW)
Assigned to WISTRON NEWEB CORP., Hsinchu (TW)
Filed by Wistron NeWeb Corp., Hsinchu (TW)
Filed on Jul. 21, 2022, as Appl. No. 17/814,037.
Claims priority of application No. 110145607 (TW), filed on Dec. 7, 2021.
Prior Publication US 2023/0178871 A1, Jun. 8, 2023
Int. Cl. H01Q 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H01Q 1/02 (2013.01) [H05K 7/20336 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A communication device comprising:
a heat dissipation case;
a heat conductive member, thermally connected to the heat dissipation case;
a heat dissipation base, pivotally connected to the heat conductive member, wherein the heat dissipation base is thermally connected to the heat conductive member and is adapted to be rotated between a first orientation and a second orientation relative to the heat conductive member; and
a communication module, affixed to the heat dissipation base, wherein the heat dissipation base comprises a first base surface, a second base surface, and a pivot slot, the first base surface and the second base surface are on opposite sides of the heat dissipation base, the communication module is disposed on the first base surface, the pivot slot is formed on the second base surface, the heat conductive member comprises a connecting rod, and the connecting rod is at least partially disposed in the pivot slot.