US 12,249,732 B2
Wiring module and power storage module
Hideyuki Kuboki, Mie (JP); Hiroomi Hiramitsu, Mie (JP); Xueqing Dong, Mie (JP); Masato Tsutsuki, Mie (JP); and Yuto Sato, Mie (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 17/620,234
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Jun. 12, 2020, PCT No. PCT/JP2020/023210
§ 371(c)(1), (2) Date Dec. 17, 2021,
PCT Pub. No. WO2020/255876, PCT Pub. Date Dec. 24, 2020.
Claims priority of application No. 2019-112789 (JP), filed on Jun. 18, 2019.
Prior Publication US 2022/0328925 A1, Oct. 13, 2022
Int. Cl. H01M 50/298 (2021.01); H01M 50/249 (2021.01); H01M 50/284 (2021.01); H01M 50/507 (2021.01); H01M 50/516 (2021.01); H05K 1/18 (2006.01)
CPC H01M 50/298 (2021.01) [H01M 50/249 (2021.01); H01M 50/284 (2021.01); H01M 50/507 (2021.01); H01M 50/516 (2021.01); H05K 1/189 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wiring module configured to attach to a power storage element group of an arranged plurality of power storage elements, each one of the power storage elements including an electrode terminal, comprising:
a bus bar that connects to the electrode terminal;
a circuit board on which a conductive path is formed; and
a relay member that connects the bus bar and the circuit board, wherein
the relay member includes a bus bar connection portion that connects to the bus bar and a board connection portion that connects to the conductive path of the circuit board,
the relay member includes a connection portion with a plate-like shape that joins the bus bar connection portion and the board connection portion and extends in a direction intersecting an arrangement direction of the plurality of power storage elements,
the connection portion includes a first deformation portion capable of deforming in the arrangement direction, and a plate surface of the first deformation portion intersects the arrangement direction, and
the first deformation portion extends from a surface of the board connection portion that is opposite to a surface of the board connection portion that connects to the conductive path of the circuit board.