US 12,249,704 B2
Method of direct embedding a lithium ion battery on a flexible printed circuit board
Kelvin Po Leung Pun, Shatin (HK); Chee-Wah Cheung, Kowloon (HK); Jason Rotanson, Kowloon (HK); Wing Lung Hon, Shatin (HK); Yam Chong, Shatin (HK); Wai Yin Wong, Shatin (HK); Shengbo Lu, Shatin (HK); and Chenmin Liu, Shatin (HK)
Assigned to Compass Technology Company Limited, New Territories (HK)
Filed by Compass Technology Company Limited, Shatin (HK)
Filed on Feb. 5, 2021, as Appl. No. 17/168,377.
Application 17/168,377 is a division of application No. 16/801,779, filed on Feb. 26, 2020, granted, now 10,917,973.
Prior Publication US 2021/0267063 A1, Aug. 26, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01M 4/139 (2010.01); H01M 10/0525 (2010.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01)
CPC H01M 4/139 (2013.01) [H01M 10/0525 (2013.01); H05K 1/16 (2013.01); H05K 3/284 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 2201/10037 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of fabricating an electrochemical lithium ion battery in between top and bottom layers of encapsulation comprising:
providing an encapsulation on a flexible printed circuit board, said encapsulation comprising top and bottom electrically insulating base films, a top electrically conductive metal layer over said top electrically insulating base film and a bottom electrically conductive metal layer under said bottom electrically insulating base film;
fabricating an anode on said bottom metal layer of said encapsulation and electrically connecting said anode directly through an electrical conductive metal trace to a power supply pin of at least one integrated circuit chip mounted on said flexible printed circuit board as a negative terminal allowing electrons to flow out of said anode;
fabricating a lithium-metal-oxide cathode on an aluminum layer, said aluminum layer Electrically connected to said top metal layer of said encapsulation and electrically connecting said cathode directly through an electrical conductive metal trace to a power supply pin of said at least one integrated circuit chip mounted on said flexible printed circuit board as a positive terminal allowing electrons to flow into said cathode;
fabricating an Ultraviolet Light (UV)-curable composite solid electrolyte between said anode and said cathode; and
sealing said encapsulation with an adhesive film surrounding said anode, said cathode, and said solid electrolyte and vertically between said top and bottom metal layers.