| CPC H01L 29/402 (2013.01) [H01L 21/02529 (2013.01); H01L 21/02634 (2013.01); H01L 21/046 (2013.01); H01L 21/26513 (2013.01); H01L 21/28537 (2013.01); H01L 21/30625 (2013.01); H01L 21/3065 (2013.01); H01L 21/324 (2013.01); H01L 29/401 (2013.01)] | 20 Claims |

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1. A method for the manufacture of a grid structure in a silicon carbide (SiC) semiconductor material, the method comprising:
providing a substrate comprising a doped semiconductor SiC material, the substrate comprising a first layer of a first conductivity type;
epitaxial growth growing at least one doped semiconductor SiC material of a second conductivity type opposite to the first conductivity type on the first layer;
removing parts of the epitaxial growth grown semiconductor SiC material to form separated second regions; and
implanting ions in the first layer to form first regions of a second conductivity type opposite to the first conductivity type such that each of the separated second regions is in contact with one of the first regions,
wherein the first regions have a lower doping concentration than the separated second regions.
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