CPC H01L 28/10 (2013.01) [H01F 27/2804 (2013.01); H01F 27/34 (2013.01); H01F 41/043 (2013.01); H01F 2027/2809 (2013.01)] | 18 Claims |
1. An integrated circuit device comprising:
a substrate having a main surface;
a core layer disposed over the substrate; and
a lithographically patterned primary coil, the primary coil comprising one or more windings wound around a winding axis parallel to the main surface, wherein each of the windings comprises:
a top conductive line arranged over the core layer, the top conductive line having a first thickness along a vertical axis perpendicular to the main surface, wherein a cross-section of the top conductive line in a plane parallel to the winding axis and perpendicular to the main surface comprises a rounded convex portion of a side surface of the top conductive line, the rounded convex portion having a radius of curvature larger than 1 micron,
a bottom conductive line arranged under the core layer, the bottom conductive line having a second thickness along the vertical axis, wherein a cross-section of the bottom conductive line in the plane comprises a rounded convex portion of a side surface of the bottom conductive line, the rounded convex portion having a radius of curvature larger than 1 micron,
a first conductive via extended along the vertical axis electrically connecting the top and bottom conductive lines, and
a second conductive via extended along the vertical axis electrically connecting one but not the other of the top and bottom conductive lines to a conductive line of another winding of the primary coil.
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