| CPC H01L 27/013 (2013.01) | 14 Claims |
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1. An integrated RC-network component comprising:
a substrate;
a capacitor having a thin-film top electrode portion at a surface on a first side of the substrate;
an insulating layer on the thin-film top electrode portion of the capacitor;
a contact plate on the insulating layer, and
one or more bridging contacts in openings traversing the insulating layer, the bridging contacts electrically connecting the thin-film top electrode portion of the capacitor to the contact plate,
wherein the RC-network component has first and second contacts, the first contact comprising said contact plate, and a series RC circuit is present between the first and second contacts,
wherein the substrate is a low ohmic doped semiconductor substrate that makes a contribution of no more than 5% to a resistance of the RC-network component,
wherein, in a direction of a thickness of the thin-film top electrode portion of the capacitor, a length of the bridging contacts is sufficiently greater than the thickness of the thin-film top electrode portion that an equivalent series resistance of the capacitor is proportional to a sheet resistance of the thin-film top electrode portion divided by a number of the bridging contacts, and
wherein the openings have an elongated peripheral shape having an aspect ratio greater than 1:1.
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