US 12,249,599 B2
Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring
Wei Chen, Union City, CA (US); Jie-Hua Zhao, Cupertino, CA (US); Jun Zhai, Cupertino, CA (US); Po-Hao Chang, Kaohsiung (TW); Hsien-Che Lin, Hsinchu (TW); Ying-Chieh Ke, New Taipei (TW); and Kunzhong Hu, Cupertino, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Mar. 31, 2023, as Appl. No. 18/194,236.
Application 18/194,236 is a continuation of application No. 17/013,279, filed on Sep. 4, 2020, granted, now 11,646,302.
Claims priority of provisional application 63/002,888, filed on Mar. 31, 2020.
Prior Publication US 2023/0317708 A1, Oct. 5, 2023
Int. Cl. H01L 25/18 (2023.01); H01L 23/24 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 23/24 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A module comprising:
a module substrate;
a first component on a top side of the module substrate;
a second component on the top side of the module substrate, the second component including peripheral lateral edges;
a stiffener structure mounted on the top side of the module substrate; and
a lid mounted on the stiffener structure and covering the first component and the second component;
wherein the lid includes a roof, a bottom surface of the roof, a trench in the bottom surface, and a component recess in the bottom surface, and wherein the component recess mates with the peripheral lateral edges of the second component, the component recess is separate from the trench, and the stiffener structure is joined to the lid within the trench; and
a thermal interface material that secures a top side of the second component to the bottom surface of the roof, wherein the thermal interface material is additionally located within the component recess in the bottom surface of the roof that mates with the peripheral lateral edges of the second component.