US 12,249,598 B2
Integrated assemblies comprising vertically-stacked decks with interconnected conductive lines
Werner Juengling, Meridian, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jul. 11, 2022, as Appl. No. 17/862,277.
Application 17/862,277 is a division of application No. 17/086,908, filed on Nov. 2, 2020, granted, now 11,410,980.
Application 17/086,908 is a division of application No. 16/213,257, filed on Dec. 7, 2018, granted, now 10,833,059, issued on Nov. 10, 2020.
Prior Publication US 2022/0344320 A1, Oct. 27, 2022
Int. Cl. H01L 25/18 (2023.01); G11C 5/02 (2006.01); G11C 8/14 (2006.01); G11C 11/408 (2006.01); G11C 11/4091 (2006.01); G11C 11/4097 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/544 (2006.01); H01L 25/065 (2023.01); H10B 12/00 (2023.01)
CPC H01L 25/18 (2013.01) [G11C 5/025 (2013.01); G11C 8/14 (2013.01); G11C 11/4085 (2013.01); G11C 11/4091 (2013.01); G11C 11/4097 (2013.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 23/544 (2013.01); H01L 25/0657 (2013.01); H10B 12/30 (2023.02); H10B 12/50 (2023.02); H01L 2223/54426 (2013.01); H01L 2223/54493 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An integrated assembly, comprising:
a base supporting first conductive lines and second conductive lines that extend parallel to each other in a first direction;
a deck over the base and comprising an array of memory cells in a single plane;
third conductive lines and fourth conductive lines supported by the deck and extending parallel to each other in a second direction different from the first direction; the third conductive lines extending from the array of the memory cells and an entirety of the structure of the third conductive lines extending outside of the array of memory cells being straight lines; and
first vertical interconnects and second vertical interconnects extending from the deck to the base, the first vertical interconnects coupling the first conductive lines to the third conductive lines and the second vertical interconnects coupling the second conductive lines to the fourth conductive lines; each of the first and second vertical interconnects coupling only one conductive line of the base to only one conductive line of the deck.