US 12,249,591 B2
Display device and method of manufacturing the same
Joo-Nyung Jang, Seoul (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Jun. 3, 2021, as Appl. No. 17/338,591.
Claims priority of application No. 10-2020-0068126 (KR), filed on Jun. 5, 2020.
Prior Publication US 2021/0384156 A1, Dec. 9, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 25/18 (2023.01); H10K 59/131 (2023.01)
CPC H01L 24/83 (2013.01) [H01L 24/32 (2013.01); H01L 25/18 (2013.01); H10K 59/131 (2023.02); H01L 2224/32145 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83874 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A display device comprising:
a display panel comprising a substrate including a display area and a non-display area adjacent to the display area, pixels on the display area, a driving circuit on the non-display area, and driving pads on the non-display area, and the pixels and the driving circuit connected to driving pads;
a circuit board overlapping the non-display area and connected to the display panel, the circuit board comprising a base layer comprising a pad area and circuit pads overlapping the pad area and disposed on the base layer, the circuit pads being spaced apart from each other in a plan view and arranged in a direction; and
a conductive adhesive member disposed between the circuit board and the display panel, the conductive adhesive member electrically connecting the circuit pads and the driving pads, wherein:
the conductive adhesive member comprises:
a first resin layer overlapping the pad area and disposed on the base layer;
a second resin layer disposed between the first resin layer and the display panel; and
conductive particles in the second resin layer, the conductive particles electrically connecting the circuit board and the display panel; and
in a plan view, the first resin layer overlaps an area between two adjacent circuit pads among the circuit pads and covers side surfaces of the two adjacent circuit pads facing in the direction;
the driving pads are exposed from an insulating layer on the substrate and overlap the display area and the non-display area;
the first resin layer and the second resin layer consist of an adhesive resin, and the second resin layer is in direct contact with the first resin layer and the insulating layer,
wherein the circuit pads include a first circuit pad disposed on the base layer and a second circuit pad covering the first circuit pad, and
wherein the second resin layer has a thickness of 0.5 times or more and 2.0 times or less than a diameter length of each of the conductive particles.