US 12,249,589 B2
Apparatus and method for BGA coplanarity and warpage control
Dongji Xie, Santa Clara, CA (US); Joe Hai, Santa Clara, CA (US); Zhongming Wu, Santa Clara, CA (US); and Ernesto A. Opiniano, Santa Clara, CA (US)
Assigned to NVIDIA Corporation, Santa Clara, CA (US)
Filed by Nvidia Corporation, Santa Clara, CA (US)
Filed on Jun. 6, 2022, as Appl. No. 17/833,063.
Prior Publication US 2023/0395559 A1, Dec. 7, 2023
Int. Cl. H01L 21/00 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 24/81 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/81201 (2013.01)] 32 Claims
OG exemplary drawing
 
1. An apparatus for flattening a warped ball grid array (BGA) package, comprising:
a first plate having a first surface and opposite second surface;
a second plate having a first surface and opposite second surface, wherein:
the first surface of the first plate and the first surface of the second plate oppose each other with a gap there-between,
the gap houses the warped BGA package there-in,
the warped BGA package includes a package substrate with solder balls attached to a device mounting surface of the package substrate to form a BGA thereon, and
the gap is adjustable by changing the position of the first plate or of the second plate such that a pushing force is applicable to the warped BGA package; and wherein
one or both of the first and second plates include corner steps having a ledge surface the corner steps defining one or more cavities such that one or both of edge portions of the device mounting surface and the die substrate mounting surface of the warped BGA package contact the ledge surface, respectively, and interior portions of the device mounting surface and the die substrate mounting surface lay within the one or more cavities, respectively, without contacting the first and the second plates.