US 12,249,583 B2
Package structure, assembly structure and method for manufacturing the same
Syu-Tang Liu, Kaohsiung (TW); Min Lung Huang, Kaohsiung (TW); Huang-Hsien Chang, Kaohsiung (TW); Tsung-Tang Tsai, Kaohsiung (TW); and Ching-Ju Chen, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Aug. 15, 2023, as Appl. No. 18/234,300.
Application 18/234,300 is a continuation of application No. 16/656,331, filed on Oct. 17, 2019, granted, now 11,728,282.
Prior Publication US 2024/0021540 A1, Jan. 18, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3675 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3512 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a wiring structure having a top surface;
a first electronic device disposed adjacent to the top surface of the wiring structure;
a second electronic device disposed adjacent to the top surface of the wiring structure, wherein the first electronic device and the second electronic device collectively define a gap therebetween;
a metal layer disposed over the wiring structure and under the gap, wherein in a cross section, the metal layer does not overlap the first electronic device in a first direction perpendicular to the top surface of the wiring structure, and the metal layer overlaps the second electronic device in the first direction; and
an underfill encapsulating the metal layer,
wherein both of the first electronic device and the second electronic device overlap the underfill in the first direction,
and wherein the second electronic device includes an electrical contact protruding beyond an active surface of the second electronic device facing the wiring structure; and
a solder material disposed between the electrical contact and the wiring structure,
wherein the electrical contact has a bottom surface facing the wiring structure, wherein the metal layer is lower than an elevation of the bottom surface of the electrical contact with respect to the top surface of the wiring structure.