US 12,249,582 B2
SIP package structure
Yaojian Lin, Wuxi (CN); Xueqing Chen, Wuxi (CN); Shasha Zhou, Wuxi (CN); Jian Chen, Wuxi (CN); Shuo Liu, Wuxi (CN); and Danfeng Yang, Wuxi (CN)
Assigned to JCET GROUP CO., LTD., Wuxi (CN)
Appl. No. 17/613,053
Filed by JCET GROUP CO., LTD., Wuxi (CN)
PCT Filed May 20, 2020, PCT No. PCT/CN2020/091227
§ 371(c)(1), (2) Date Nov. 20, 2021,
PCT Pub. No. WO2021/008228, PCT Pub. Date Jan. 21, 2021.
Claims priority of application No. 201910641045.X (CN), filed on Jul. 16, 2019.
Prior Publication US 2022/0223539 A1, Jul. 14, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/552 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49822 (2013.01); H01L 23/5385 (2013.01); H01L 25/18 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An SIP package structure, comprising a first module and a second module, the first module and the second module are vertically stacked, wherein electromagnetic sensitive frequencies of the first module and the second module are different; the SIP package structure further comprises a shielding assembly; the shielding assembly comprises a first shielding structure covering the first module and a second shielding structure covering the second module; and at least one part of the first shielding structure or a part of the second shielding structure is disposed between the first module and the second module; wherein the first module and the second module have at least one element with different electromagnetic sensitivity frequencies; and the second module is disposed on a front side of the first module; and at least part of the first shielding structure is disposed between the first module and the second module; and the first shielding structure comprises a shielding metal layer disposed between the first module and the second module; and the second shielding structure covers a front side and a lateral side of the second module, and a bottom end of a second shielding structure encompassing a side of said second module is bent inwardly or outwardly and electrically connected in face contact to the shielding metal layer below it.