US 12,249,571 B2
Pre-mold substrate and method of manufacturing pre-mold substrate
Kwang Jae Yoo, Changwon-si (KR); Jong Hoe Ku, Gimhae-si (KR); and In Seob Bae, Changwon-si (KR)
Assigned to HAESUNG DS CO., LTD., Changwon-si (KR)
Appl. No. 17/428,258
Filed by HAESUNG DS CO., LTD., Changwon-si (KR)
PCT Filed Jun. 24, 2021, PCT No. PCT/KR2021/007958
§ 371(c)(1), (2) Date Aug. 3, 2021,
PCT Pub. No. WO2022/270654, PCT Pub. Date Dec. 29, 2022.
Claims priority of application No. 10-2021-0080404 (KR), filed on Jun. 21, 2021.
Prior Publication US 2024/0038652 A1, Feb. 1, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 21/3213 (2006.01); H01L 23/31 (2006.01); H01L 23/482 (2006.01)
CPC H01L 23/49861 (2013.01) [H01L 21/32139 (2013.01); H01L 23/3121 (2013.01); H01L 23/482 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A pre-mold substrate, comprising:
an electroconductive base member, which comprises a first pre-mold groove formed in a bottom surface and a second pre-mold groove formed in a top surface and constitutes a circuit pattern;
a first pre-mold resin disposed in the first pre-mold groove; and
a second pre-mold resin disposed in the second pre-mold groove, wherein:
a bottom surface of a first portion of the electroconductive base member is coplanar with a surface of the first pre-mold resin;
the first portion of the electroconductive base member has a respective height;
a top surface of a second portion of the electroconductive base member is coplanar with a surface of the second pre-mold resin; and
the second portion of the electroconductive base member has a respective height which is less than the respective height of the first portion of the electroconductive base member, wherein the first portion of the electroconductive base member comprises a step down from a height of the surface of the second pre-mold resin to a height of an interface between the first and second pre-mold resins.