US 12,249,567 B2
Manufacturing method of integrated substrate structure
Dyi-Chung Hu, Hsinchu (TW)
Filed by Dyi-Chung Hu, Hsinchu (TW)
Filed on Nov. 13, 2023, as Appl. No. 18/508,173.
Application 18/508,173 is a division of application No. 17/356,534, filed on Jun. 24, 2021, granted, now 11,862,545.
Claims priority of provisional application 63/057,307, filed on Jul. 28, 2020.
Prior Publication US 2024/0079304 A1, Mar. 7, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/10 (2006.01)
CPC H01L 23/49833 (2013.01) [H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/4882 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/105 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A manufacturing method of an integrated substrate structure, comprising:
forming a fine redistribution structure over a temporary carrier;
forming a plurality of first trenches in the fine redistribution structure to form a plurality of fine redistribution segments;
coupling a coarse redistribution structure to the plurality of fine redistribution segments through a plurality of conductive connectors, wherein a size of the coarse redistribution structure is greater than a size of the plurality of fine redistribution segments, wherein coupling the coarse redistribution structure to the plurality of fine redistribution segments comprises:
forming a plurality of solder balls on the coarse redistribution structure before the coupling; and
attaching the plurality of solder balls on fine circuitries of the plurality of fine redistribution segments; and
removing the temporary carrier from the plurality of fine redistribution segments after the coupling.