US 12,249,564 B2
Package structure, RDL structure comprising redistribution layer having ground plates and signal lines
Chien-Hsun Chen, Pingtung County (TW); Jiun-Yi Wu, Taoyuan (TW); and Shou-Yi Wang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 24, 2023, as Appl. No. 18/306,194.
Application 18/306,194 is a continuation of application No. 17/395,450, filed on Aug. 5, 2021, granted, now 11,670,575.
Application 17/395,450 is a continuation of application No. 16/441,020, filed on Jun. 14, 2019, granted, now 11,088,059, issued on Aug. 10, 2021.
Prior Publication US 2023/0260882 A1, Aug. 17, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/49822 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 21/6835 (2013.01); H01L 23/145 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/0652 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/92125 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a die; and
a redistribution layer (RDL) structure, electrically connected to the die, wherein the RDL structure comprises:
a first redistribution layer, comprising a first ground plate;
a second redistribution layer, comprising a second ground plate and a signal trace, wherein the signal trace is laterally spaced from the second ground plate; and
a third redistribution layer, comprising a third ground plate, wherein the third redistribution layer and the first redistribution layer are disposed on opposite sides of the second redistribution layer,
wherein the first ground plate comprises a first slot at a position overlapped with the signal trace in the direction perpendicular to the top surface of the signal trace, and there is free of conductive feature within the first slot,
wherein the third ground plate comprises a second slot at a position overlapped with the signal trace in the direction perpendicular to the top surface of the signal trace.