US 12,249,560 B2
Electronic device and method for manufacturing electronic device
Kazunori Fuji, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoyo (JP)
Appl. No. 17/430,995
Filed by ROHM CO., LTD., Kyoto (JP)
PCT Filed Mar. 11, 2020, PCT No. PCT/JP2020/010600
§ 371(c)(1), (2) Date Aug. 13, 2021,
PCT Pub. No. WO2020/195847, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-057932 (JP), filed on Mar. 26, 2019.
Prior Publication US 2022/0148944 A1, May 12, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49513 (2013.01) [H01L 21/4825 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An electronic device comprising:
an electronic component;
a support member that includes a mount surface on which the electronic component is mounted; and
a bonding material that is provided between the electronic component and the support member to fixedly attach the electronic component to the support member,
wherein the mount surface includes a first region where a plurality of first grooves are formed and a second region where a plurality of second grooves are formed, the second region surrounding the first region as viewed in a first direction,
the plurality of first grooves overlap with the electronic component as viewed in the first direction,
in plan view of the mount surface, the plurality of first grooves and the plurality of second grooves extend linearly in a direction perpendicular to the first direction,
the plurality of first grooves are arranged in parallel to each other,
the bonding material is in contact with the first region, and is not in contact with the second region,
at least one of the plurality of second grooves has an end that reaches an edge of the mount surface, and
the mount surface further includes a third region that is provided between the first region and the second region as viewed in the first direction.