| CPC H01L 23/473 (2013.01) [H01L 23/3675 (2013.01)] | 16 Claims |
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1. A cooler, comprising:
a top plate, one surface of which serves as a heat dissipation surface;
a bottom plate disposed so as to face the top plate and having a thickness greater than a thickness of the top plate;
a plurality of fins provided between the top plate and the bottom plate;
a circumferential wall part provided between the top plate and the bottom plate so as to surround an outer circumference of the plurality of fins along outer circumferential edges of the bottom plate; and
a bonding material that bonds the plurality of fins and the circumferential wall part to the top plate, wherein
the plurality of fins and the outer circumferential wall part are bonded to the heat dissipation surface of the top plate, and a flow path for a coolant is formed by a space enclosed by the top plate, the bottom plate, the plurality of fins and the circumferential wall part,
the top plate has an electric potential higher than an electric potential of the bottom plate,
the bonding material is made of a material containing mainly aluminum that is equal to or greater than 80%, by mass %, and further contains Si and Zn in the ranges 0.25%≤Si≤7.5% and 0≤Zn≤0.25%, and
the bottom plate made of a material mainly containing aluminum, and further contains:
Si and Mg in the ranges 0.2%≤Si≤1.5% and 0.35%≤Mg≤1.5%, Si,
Mg, Cu and Zn in the ranges 0.2%≤Si≤1.5%, 0.35%≤Mg≤1.5%, 0≤Cu≤0.7%, and 0≤Zn≤0.7%, or
Si, Mg, Cu and Zn in the ranges 4.5%≤Si≤13.5%, 0≤Mg≤1.3%, 0≤ Cu≤1.3% and 0≤Zn≤0.25%.
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