US 12,249,553 B2
Thermal contacts at periphery of integrated circuit packages
Sonja Koller, Regensburg (DE); Vishnu Prasad, Munich (DE); and Georg Seidemann, Landshut (DE)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel IP Corporation, Santa Clara, CA (US)
Filed on Jun. 22, 2018, as Appl. No. 16/015,334.
Prior Publication US 2019/0393125 A1, Dec. 26, 2019
Int. Cl. H01L 23/367 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/56 (2013.01); H01L 23/3121 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package, comprising:
a package substrate;
an IC die coupled to the package substrate, an upper surface of the IC die comprising a first portion and a different second portion;
a thermal contact for coupling to at least a portion of a heat exchanger, the thermal contact in a region at a periphery of the IC package, a lower surface of the thermal contact comprising a third portion and a different fourth portion; and
a mold over the first portion of the upper surface of the IC die in plan view and directly under the third portion of the lower surface of the thermal contact,
wherein:
the thermal contact comprises a thermally conductive material,
the fourth portion of the lower surface of the thermal contact overlaps the second portion of the upper surface of the IC die,
the mold extends to a first distance over the upper surface of the IC die,
the thermal contact extends to a second distance over the upper surface of the IC die,
the second distance is less than the first distance,
the mold over the first portion of the upper surface of the IC die has a first side surface perpendicular to the upper surface of the IC die,
the thermal contact has a second side surface perpendicular to the upper surface of the IC die, and
the first side surface of the mold is in direct contact with the second side surface of the thermal contact.