US 12,249,549 B2
Package for an integrated circuit and manufacturing method
Jerome Lopez, Saint Jean de Moirans (FR)
Assigned to STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed by STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed on Apr. 9, 2024, as Appl. No. 18/630,676.
Application 18/630,676 is a division of application No. 17/522,327, filed on Nov. 9, 2021, granted, now 11,984,373.
Claims priority of application No. 2011727 (FR), filed on Nov. 16, 2020.
Prior Publication US 2024/0258184 A1, Aug. 1, 2024
Int. Cl. H01L 23/31 (2006.01); H01L 23/10 (2006.01); H01L 23/12 (2006.01); H01L 33/52 (2010.01)
CPC H01L 23/3114 (2013.01) [H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 33/52 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A package, comprising:
a support substrate having a mounting face including a first electrical zone and a second electrical zone;
an electronic chip mounted to the mounting face;
an encapsulation hood including an electrically conductive path extending from a first end to a second end, said first and second ends located at a bottom edge of the encapsulation hood;
wherein a bottom edge of the encapsulation hood faces the mounting face of the support substrate;
a spot of conductive glue covering each of the first and second electrical zones;
a first electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the first electrical zone and a second leg in contact with the first end of the electrically conductive path at the bottom edge of the encapsulation hood; and
a second electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the second electrical zone and a second leg in contact with the second end of the electrically conductive path at the bottom edge of the encapsulation hood.