| CPC H01L 23/13 (2013.01) [H01L 23/3114 (2013.01); H01L 23/49822 (2013.01); H01L 23/49861 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H05K 3/46 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/48227 (2013.01)] | 14 Claims |

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1. An electronic component mounting substrate, comprising:
a substrate having an upper surface including a first edge and a second edge that do not intersect with each other;
a plurality of first electrodes arranged along the first edge on the upper surface;
a plurality of second electrodes arranged along the second edge on the upper surface; and
a plurality of third electrodes and a plurality of fourth electrodes on the upper surface, wherein
the upper surface has a protrusion portion located between the plurality of first electrodes and the plurality of second electrodes in a top view, a first step portion extending along the first edge and lower than the protrusion portion, and a second step portion extending along the second edge and lower than the protrusion portion, the protrusion portion includes an electronic component mounting area,
the plurality of first electrodes are located on the first step portion,
the plurality of second electrodes are located on the second step portion,
the upper surface has a third edge and a fourth edge that intersect the first edge and the second edge, respectively, and has a third step portion extending along the third edge and lower than the protrusion portion and a fourth step portion extending along the fourth edge and lower than the protrusion portion,
the plurality of third electrodes are located on the third step portion, and
the plurality of fourth electrodes are located on the fourth step portion.
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