US 12,249,540 B1
Managing trench depth in integrated systems
Benoît Filion, Lévis (CA); Charles Baudot, Quebec (CA); François Pelletier, Quebec (CA); and Christine Latrasse, Quebec (CA)
Assigned to Ciena Corporation, Hanover, MD (US)
Filed by Ciena Corporation, Hanover, MD (US)
Filed on Jan. 12, 2022, as Appl. No. 17/574,162.
Application 17/574,162 is a division of application No. 16/897,865, filed on Jun. 10, 2020, granted, now 11,227,790.
Claims priority of provisional application 62/859,955, filed on Jun. 11, 2019.
Int. Cl. H01L 21/76 (2006.01); G02B 6/136 (2006.01); H01L 21/308 (2006.01); H01L 21/762 (2006.01); B81C 1/00 (2006.01); G02B 6/12 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01)
CPC H01L 21/76229 (2013.01) [G02B 6/136 (2013.01); H01L 21/3085 (2013.01); H01L 21/76283 (2013.01); B81C 1/00412 (2013.01); G02B 2006/12176 (2013.01); H01L 21/30604 (2013.01); H01L 21/3065 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An article of manufacture, comprising:
one or more photonic structures formed within one or more layers over a surface of a substrate; and
a plurality of trenches formed through the one or more layers with one or more of the trenches housing one or more devices coupled to one or more of the photonic structures, the plurality of trenches including:
a first trench that has a bottom surface within the substrate that has a first surface topology characterized by a first surface roughness at a first depth within the substrate relative to the surface of the substrate, and
a second trench that has a bottom surface within the substrate that has a second surface topology characterized by a second surface roughness at a second depth within the substrate relative to the surface of the substrate;
where the first surface roughness is greater than the second surface roughness, and the second depth is greater than the first depth.