| CPC H01L 21/68764 (2013.01) [B65G 47/248 (2013.01); C23C 14/34 (2013.01); C23C 14/566 (2013.01); H01L 21/68728 (2013.01)] | 16 Claims |

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1. A module of a processing system for flipping a substrate in vacuum, the module comprising:
a clamp assembly for securing a substrate placed in a first plane;
a first motor assembly coupled to the clamp assembly for rotating the clamp assembly around a first direction that is parallel to the first plane;
a first plate;
a second plate parallel to the first plate, the second plate movably coupled to the first plate in a second direction that is perpendicular to the first plane by a pair of spring-loaded connectors, the pair of spring-loaded connectors biasing the first and second plates towards each other to a clamped position, wherein each of the pair of spring-loaded connectors includes a pin disposed through the first and second plates and a pair of springs disposed at opposite ends of the pin; and
a slide coupled to the clamp assembly on a side opposite the first motor assembly in the first direction, wherein the slide comprises a bearing support that supports:
rotation of the clamp assembly by the first motor assembly around the first direction through a rotatable bearing.
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