US 12,249,533 B2
Substrate processing apparatus
Yoshinori Ikeda, Kumamoto (JP); and Toru Hirata, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Apr. 27, 2021, as Appl. No. 17/241,504.
Claims priority of application No. 2020-081463 (JP), filed on May 1, 2020.
Prior Publication US 2021/0343576 A1, Nov. 4, 2021
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68721 (2013.01) [H01L 21/67051 (2013.01); H01L 21/67075 (2013.01); H01L 21/6708 (2013.01); H01L 21/68728 (2013.01); H01L 21/68785 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a plurality of gripping mechanisms that grip a peripheral edge of a substrate; and
a base plate located below the substrate gripped by the plurality of gripping mechanism and supporting the plurality of gripping mechanisms, wherein
the base plate includes a plurality of liquid drain holes that discharge a processing liquid flowing from the substrate to an upper surface of the base plate through the plurality of gripping mechanisms,
the base plate includes a groove part provided on the upper surface of the base plate at a position where the processing liquid flows from the substrate to the upper surface of the base plate through the plurality of gripping mechanisms to extend along a circumferential direction of the substrate,
the liquid drain holes are provided in the groove part along the circumferential direction of the substrate, and
an interval between the liquid drain holes located in a first area that includes peripheral areas of each gripping mechanism of the plurality of gripping mechanisms in the groove part is less than an interval between the liquid drain holes located in a second area, other than the first area, in the groove part.