US 12,249,526 B2
Detecting damaged semiconductor wafers utilizing a semiconductor wafer sorter tool of an automated materials handling system
Chen Min Lin, Keelung (TW); and Hsien Tse Chen, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 6, 2023, as Appl. No. 18/178,772.
Application 18/178,772 is a continuation of application No. 16/915,273, filed on Jun. 29, 2020, granted, now 11,600,504.
Prior Publication US 2023/0207357 A1, Jun. 29, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/67271 (2013.01) [G01N 21/8851 (2013.01); G01N 21/9503 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); G01N 2021/8887 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
performing image recognition of an image of a semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged;
determining, based on the image recognition, that the edge of the semiconductor wafer is damaged based on:
a quantity of one or more portions of the edge missing from the semiconductor wafer satisfying a threshold quantity, and
a size of the one or more portions of the edge missing from the semiconductor wafer satisfying a threshold size; and
causing the semiconductor wafer to be selectively provided to a first wafer carrier or a second wafer carrier based on whether the edge of the semiconductor wafer is determined to be damaged,
wherein the semiconductor wafer is to be provided to the first wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and
wherein the semiconductor wafer is to be provided to the second wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.