US 12,249,523 B2
Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer
Juergen Kielwein, Rankweil (AT); Bart Scholte Von Mast, Azmoos (CH); and Rogier Lodder, Bad Ragaz (CH)
Assigned to Evatec AG, Trubbach (CH)
Filed by Evatec AG, Trubbach (CH)
Filed on Oct. 3, 2017, as Appl. No. 15/723,266.
Application 15/723,266 is a division of application No. 13/220,903, filed on Aug. 30, 2011, granted, now 9,793,144.
Prior Publication US 2018/0025925 A1, Jan. 25, 2018
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67115 (2013.01) 25 Claims
OG exemplary drawing
 
1. A wafer holder and temperature conditioning arrangement to be mounted to a vacuum wafer treatment chamber, comprising:
a base arrangement with an extended, essentially plane surface bordered by a protruding circular rim surface about a center of said essentially plane surface;
a metal circular wafer carrier plate mounted centered with respect to said center of said essentially plane surface, a first surface of said metal circular wafer carrier plate, said extended, essentially plane surface and said protruding circular rim surface commonly defining a heater compartment, said metal circular wafer carrier plate being drivingly rotatable about a geometric axis through said center of said extended, essentially plane surface, said metal circular wafer carrier plate being drivingly rotatable relative to said base arrangement;
a multitude of straight heater lamp tubes arranged in said heater compartment along said extended, essentially plane surface and along the first surface of said metal circular wafer carrier plate and directly exposed to said first surface of said metal circular wafer carrier plate and mounted to said base arrangement;
a gas outlet-and dispending-arrangement through and along a second surface of said metal circular wafer carrier plate configure to provide a cushion of back gas between the metal circular wafer carrier plate and a single wafer, the back gas being supplied through a gas feed line centrally within a driver shaft of the metal circular wafer carrier plate; and
a wafer retaining arrangement operationally coupled to said metal circular wafer carrier plate,
wherein said heater compartment is operated in vacuum atmosphere,
wherein the metal circular wafer carrier plate is configured to support the single wafer, and
wherein the length extension direction of all of said straight heater lamp tubes is equally angularly offset from a radial direction from said center to said circular rim surface.