| CPC H01L 21/67109 (2013.01) [C30B 33/02 (2013.01); C30B 35/00 (2013.01); F27D 7/02 (2013.01); H01L 21/324 (2013.01); H01L 21/67248 (2013.01); H01L 21/67323 (2013.01)] | 11 Claims |

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1. A method of annealing a plurality of wafers, the method comprising:
positioning the plurality of wafers in a heater assembly within a lower interior portion of a chamber body, the heater assembly comprising a sidewall with a double-walled labyrinthine exit flow path to provide fluid communication between an interior of the heater assembly and an upper interior portion of the chamber body, the chamber body including a steam source in fluid communication with the interior of the heating assembly through a steam injection port;
heating the plurality of wafers; and
pressurizing the chamber body to a predetermined pressure by flowing steam into the heater assembly through the steam injection port, wherein the steam injection port provides a fluid path into the interior of the heater assembly and the double-walled labyrinthine exit flow path defining an exit flow path of steam from the interior of the heater assembly into the upper interior portion of the chamber body through the double-walled labyrinthine exit flow path in the heater assembly.
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