US 12,249,519 B2
Molded chip package with anchor structures
Priyal Shah, Santa Clara, CA (US); Milind S. Bhagavat, Broomfield, CO (US); Brett P. Wilkerson, Austin, TX (US); Lei Fu, Austin, TX (US); and Rahul Agarwal, Livermore, CA (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Jun. 17, 2022, as Appl. No. 17/843,938.
Application 17/843,938 is a division of application No. 16/513,450, filed on Jul. 16, 2019, granted, now 11,367,628.
Prior Publication US 2022/0319871 A1, Oct. 6, 2022
Int. Cl. H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 21/566 (2013.01) [H01L 23/3157 (2013.01)] 19 Claims
OG exemplary drawing
 
14. A method of manufacturing a semiconductor chip package substrate, comprising:
mounting a semiconductor chip on a first side of a package substrate, the package substrate having a central region configured to the semiconductor chip mounted thereon;
mounting a stiffener ring on the first side of a package substrate, the stiffener ring comprising a continuous formation of metal and having a central opening to accommodate the semiconductor chip and plural openings; and
molding a molding layer on the package substrate and at least partially encapsulating the semiconductor chip and the stiffener ring, the plural openings being filled with portions of the molding layer wherein physical engagement of the portions in the plural openings anchor the molding layer to the package substrate.