| CPC H01J 37/3488 (2013.01) [C23C 14/35 (2013.01); C23C 14/50 (2013.01); C23C 14/562 (2013.01); H01J 37/32743 (2013.01); H01J 37/32788 (2013.01); H01J 37/3435 (2013.01); C23C 14/34 (2013.01)] | 10 Claims |

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1. A sputter deposition apparatus comprising:
a substrate support assembly arranged to support a substrate;
a target support assembly arranged to support at least one sputter target for use in a sputter deposition of a target material onto the substrate;
a plasma generation arrangement arranged to provide plasma for said sputter deposition; and
a cartridge arranged to contain the substrate with deposited target material from the at least one sputter target after said sputter deposition, wherein the cartridge comprises the target support assembly, and the at least one sputter target supported by the target support assembly,
wherein the cartridge is configured as removable from the sputter deposition apparatus, and upon removal the cartridge contains each of the target support assembly, the at least one sputter target supported by the target support assembly, and the substrate with the deposited target material after said sputter deposition.
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