US 12,249,497 B2
Sputtering apparatus
Hyun-Woo Kim, Cheonan-si (KR); Sangmok Nam, Seongnam-si (KR); Jaeho Byeon, Asan-si (KR); Jongho Hyun, Cheonan-si (KR); and Nam-Jin Hyung, Cheonan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Apr. 8, 2024, as Appl. No. 18/629,457.
Application 18/629,457 is a continuation of application No. 17/717,521, filed on Apr. 11, 2022, granted, now 11,978,615.
Claims priority of application No. 10-2021-0100464 (KR), filed on Jul. 30, 2021.
Prior Publication US 2024/0258088 A1, Aug. 1, 2024
Int. Cl. H01J 37/34 (2006.01); C23C 14/35 (2006.01)
CPC H01J 37/347 (2013.01) [C23C 14/35 (2013.01); H01J 37/3435 (2013.01); H01J 37/3455 (2013.01); H01J 2237/332 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A sputtering apparatus comprising:
a back plate supporting a sputtering target;
a magnet module disposed under the back plate and including a magnet unit reciprocating in a first direction;
a first shielding member attached on a portion of the magnet unit, moving together with the magnet unit, and covering at least a portion of the magnet unit;
a protective sheet disposed between the back plate and the magnet module; and
a second shielding member disposed between the back plate and the magnet module, and having a fixed position,
wherein the protective sheet is in contact with the second shielding member, the first shielding member is disposed between the magnet module and the second shielding member, and
wherein the second shielding member overlaps an end of the sputtering target having a length extending in the first direction.