US 12,249,496 B2
Semiconductor processing apparatus and magnetron mechanism
Yujie Yang, Beijing (CN); and Xiaoyan Wang, Beijing (CN)
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Appl. No. 17/921,088
Filed by BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
PCT Filed Apr. 16, 2021, PCT No. PCT/CN2021/087780
§ 371(c)(1), (2) Date Oct. 24, 2022,
PCT Pub. No. WO2021/213273, PCT Pub. Date Oct. 28, 2021.
Claims priority of application No. 202010331542.2 (CN), filed on Apr. 24, 2020.
Prior Publication US 2023/0170196 A1, Jun. 1, 2023
Int. Cl. C23C 14/35 (2006.01); H01J 37/34 (2006.01)
CPC H01J 37/3408 (2013.01) [C23C 14/35 (2013.01); H01J 37/3455 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A magnetron mechanism, applied to a semiconductor processing apparatus, comprising:
a backplane;
an outer magnetic pole arranged on a bottom surface of the backplane and enclosing to form accommodation space and comprising an outer arc portion and an inner arc portion in a plane spiral shape, the outer arc portion and the inner arc portion being connected in series, with an opening between two ends of the outer arc portion and the inner arc portion that are not connected; and
an inner magnetic pole arranged on the bottom surface of the backplane and located in the accommodating space, the inner magnetic pole moving to change a corrosion area of a target material, and a distance between the inner magnetic pole and the outer magnetic pole being always greater than a predetermined distance during movement.