US 12,249,494 B2
Remote plasma cleaning of chambers for electronics manufacturing systems
Yuanhong Guo, Mountain View, CA (US); Sheng Guo, Santa Clara, CA (US); Marek Radko, San Jose, CA (US); Steve Sansoni, Livermore, CA (US); Xiaoxiong Yuan, San Jose, CA (US); See-Eng Phan, Santa Clara, CA (US); Yuji Murayama, Los Gatos, CA (US); Pingping Gou, San Mateo, CA (US); and Song-Moon Suh, Seoul (KR)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 2, 2023, as Appl. No. 18/500,951.
Application 18/500,951 is a continuation of application No. 17/214,707, filed on Mar. 26, 2021, granted, now 11,854,773.
Claims priority of provisional application 63/002,994, filed on Mar. 31, 2020.
Prior Publication US 2024/0062999 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32825 (2013.01) [H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01J 37/32889 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of cleaning a transfer chamber for an electronics manufacturing system, comprising:
flowing a gas mixture comprising oxygen and a carrier gas into a remote plasma generator;
generating a plasma from the gas mixture by the remote plasma generator; and
performing a remote plasma cleaning of the transfer chamber by flowing the plasma into an interior of the transfer chamber, the transfer chamber comprising a plurality of ports, wherein substrates are transferred through the transfer chamber and through the plurality of ports, and wherein the plasma removes a plurality of organic contaminants from the transfer chamber.