US 12,249,492 B2
Electrostatic chuck device
Masaki Hirayama, Tokyo (JP); and Tetsuro Itagaki, Tokyo (JP)
Assigned to SUMITOMO OSAKA CEMENT CO., LTD., Tokyo (JP)
Appl. No. 17/999,823
Filed by SUMITOMO OSAKA CEMENT CO., LTD., Tokyo (JP)
PCT Filed May 27, 2021, PCT No. PCT/JP2021/020234
§ 371(c)(1), (2) Date Nov. 23, 2022,
PCT Pub. No. WO2022/004211, PCT Pub. Date Jan. 6, 2022.
Claims priority of application No. 2020-111804 (JP), filed on Jun. 29, 2020.
Prior Publication US 2023/0215704 A1, Jul. 6, 2023
Int. Cl. H01J 37/32 (2006.01); H01L 21/683 (2006.01)
CPC H01J 37/32715 (2013.01) [H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H01J 37/32642 (2013.01); H01L 21/6833 (2013.01); H01J 37/32577 (2013.01); H01J 2237/2007 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electrostatic chuck device comprising:
an electrostatic chuck plate which has
a dielectric substrate having a placement surface on which a wafer is placed and
an adsorption electrode which is positioned in the dielectric substrate;
a metal base which supports the electrostatic chuck plate from a back surface side opposite to the placement surface; and
a focus ring which is installed on an outer peripheral portion of the electrostatic chuck plate and surrounds the placement surface,
wherein the electrostatic chuck plate has
a ring adsorption region, which is adsorbed to the focus ring and is located on a surface which is positioned on a same side as the placement surface, and
a base adsorption region, which is adsorbed to the metal base and is located on a back surface which is opposite to the placement surface,
wherein one or both of the base adsorption region of the electrostatic chuck plate and a surface of the metal base which faces the base adsorption region, have a plurality of protrusion portions which are distributed in a planar direction of the electrostatic chuck plate, and
distribution density of the plurality of protrusion portions in the base adsorption region is different between a region overlapping the placement surface in plan view and a region overlapping the ring adsorption region in plan view.