| CPC H01J 37/32715 (2013.01) [H01J 37/32568 (2013.01); H01J 37/32577 (2013.01); H01J 37/32082 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/3343 (2013.01); H01L 21/3065 (2013.01)] | 9 Claims |
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1. A substrate support unit provided in an apparatus for treating a substrate using plasma, the substrate support unit comprising:
a dielectric plate on which the substrate is placed;
a lower electrode disposed under the dielectric plate, the lower electrode having a first diameter;
a power supply rod configured to apply RF power to the lower electrode, the power supply rod having a second diameter; and
a ground member disposed under the lower electrode and spaced apart from the lower electrode by a first gap by an insulating member, the ground member including a plate portion parallel to the lower electrode, and the plate portion having a through-hole formed therein through which the power supply rod passes, wherein the through-hole has a third diameter,
wherein the lower electrode includes a deformation portion extending downward from a center of a lower surface of the lower electrode, and having a decreasing diameter toward the bottom, and the power supply rod is coupled to an end portion of the deformation portion,
wherein the ground member has a guide portion extending upwardly in the first gap from an inner diameter of the through-hole by a predetermined length.
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