US 12,249,467 B2
Electronic component
Shinya Onodera, Tokyo (JP); Akitoshi Yoshii, Tokyo (JP); and Kyohei Takata, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jun. 4, 2024, as Appl. No. 18/733,322.
Application 18/733,322 is a division of application No. 17/559,552, filed on Dec. 22, 2021.
Claims priority of application No. 2020-219273 (JP), filed on Dec. 28, 2020.
Prior Publication US 2024/0321521 A1, Sep. 26, 2024
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
an element body of a rectangular parallelepiped shape including a pair of end surfaces opposing each other in a first direction, a pair of first side surfaces opposing each other in a second direction, and a pair of second side surfaces opposing each other in a third direction;
a plurality of external electrodes disposed on both ends of the element body in the first direction; and
a plurality of internal electrodes disposed in the element body to be distributed in the second direction and electrically connected to corresponding external electrodes of the plurality of external electrodes,
wherein each of the plurality of external electrodes includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer,
for each of the two conductive resin layers located on the same second side surface, one conductive resin layer includes an edge opposing another conductive resin layer,
the conductive resin layer includes:
a first region including a plurality of metal particles of a first content and a resin; and
a second region including a plurality of metal particles of a second content smaller than the first content and a resin, and
the second region is located closer to the edge of the conductive resin layer than the first region, and includes the edge of the conductive resin layer.